Chip placement

SERMA Microelectronics places chips and components on organic and non-organic substrates (ceramic supports).

Our equipment enables us to pick and place chips ranging in size from 0.3×0.3 mm² to over 100×25 mm² with a precision of ±25µm.

Technologies implemented:

Bonding (conductive or insulating adhesive)
Brazing (eutectic with several types of alloys, some containing lead and others lead-free)
Soft solder
High-temperature brazing
Vacuum brazing
Cyanate ester
Silver sintering
Etc.

Components are picked and placed using an automatic MYDATA machine, from the smallest types (01005) to high-density BGAs.