SERMA Microelectronics places chips and components on organic and non-organic substrates (ceramic supports).
Our equipment enables us to pick and place chips ranging in size from 0.3×0.3 mm² to over 100×25 mm² with a precision of ±25µm.
- Bonding (conductive or insulating adhesive)
- Brazing (eutectic with several types of alloys, some containing lead and others lead-free)
- Soft solder
- High-temperature brazing
- Vacuum brazing
- Cyanate ester
- Silver sintering
Components are picked and placed using an automatic MYDATA machine, from the smallest types (01005) to high-density BGAs.