SERMA Microelectronics studies the packaging design. The goal is to “wrap up” the product diagram and parts list while respecting the mechanical constraints: volume, support devices, interface, connections with the outside world and finishing touches.
This work is performed on a 3D CAD work station and may include if necessary a validation step with calculation report and/or thermo-mechanical simulation.
We handle the following issues:
- Internal sequencing of the product (design and surface of the substrates, partitioning)
- Internal and external connections
- Conformity with environmental requirements (salt spray tests, impacts/vibrations, temperature range, EMC, etc.)