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R&D

In order to continually offer new technologies to its clients, SERMA MICROELECTRONICS has a multi-year Research and Development plan. SERMA MICROELECTRONICS’ R&D approach has made it possible to develop, among other things, over the past few years, sovereign plastic packaging technologies for low and medium volumes (QFN, BGA…).

Since then, Research and Development operations have been focused on the more advanced integration of semiconductors or special processes. Among the projects developed at our production sites in La Rochelle and Toulouse, we can find:

  • The creation of interconnection layers on individual chips (UBM – Under Bump Metallization) to enable flip-chip mounting
  • The addition of metallic bumps on these layers to achieve interconnection
  • The creation and deposition of Redistribution Layers (RDL)
  • The mounting of such chips using high-precision flip-chip technologies
  • The development of clip bonding for high-power applications
  • The modification of component finishing metallization to improve their long-term reliability.
 

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