Our equipment enables us to implement Wedge and Ball solutions (automatic and semi-automatic) in various types of wires:
- Ball bonding (Au 17 to 75µ, Cu 25)
- Wedge bonding (Al & Au – 17 to 75µ)
- “Thick” wiring (Al 125 à 500µ)
Our equipment enables us to implement Wedge and Ball solutions (automatic and semi-automatic) in various types of wires: