Column attach (CGA)

SERMA Microelectronics meets your requirements in terms of reliability for high-integration hermetic components to be welded onto an organic support structure.

Variations in dilation coefficient gradually weaken the component/PCB connection, especially in the case of LGA/BGA-type components.

The solution provided by SERMA Microelectronics involves inserting columns between the component and the support structure: these columns absorb the mechanical stress exerted on the solder joints.

We developed this solution, known as “Column Attach”, for which we have obtained CAPABILITY APPROVAL from the ESA (European Space Agency).

A special machine has been built and the validated, mature process now enables us to offer any type of package with column attach, ranging from LGA 625 to LGA 1752 pins. The components are of the FM (Flight Model) type.